ForTii® XS81B
Polyamide 4T
产品说明:
50% Glass Reinforced
Used In:
ForTii® is a breakthrough high temperature polyamide with halogen-free flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want €" and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
填料/增强材料 | |
用途 | |
加工方法 | |
树脂ID (ISO 1043) | |
密度 | 1.63 | -- | g/cm³ | ISO 1183 |
吸水率 (平衡, 73°F, 50% RH) | 1.8 | -- | % | ISO 62 |
拉伸模量 | 2.47E+6 | 2.47E+6 | psi | ISO 527-2 |
拉伸应力 (断裂) | 40600 | 33400 | psi | ISO 527-2 |
拉伸应变 (断裂) | 2.5 | 2.3 | % | ISO 527-2 |
弯曲模量 | 2.39E+6 | -- | psi | ISO 178 |
弯曲应力 | 55100 | -- | psi | ISO 178 |
简支梁缺口冲击强度 (73°F) | 6.9 | -- | ft·lb/in² | ISO 179/1eA |
简支梁无缺口冲击强度 (73°F) | 43 | -- | ft·lb/in² | ISO 179/1eU |
热变形温度 (264 psi, 未退火) | 473 | -- | °F | ISO 75-2/A |
熔融温度 2 | 599 | -- | °F | ISO 11357-3 |
可燃性等级 (0.06 in) | HB | -- |
| IEC 60695-11-10, -20 |
干燥温度 | 212 | °F |
|
干燥时间 | 4.0 到 8.0 | hr |
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料筒后部温度 | 608 到 626 | °F |
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料筒中部温度 | 617 到 635 | °F |
|
料筒前部温度 | 626 到 635 | °F |
|
射嘴温度 | 626 到 635 | °F |
|
加工(熔体)温度 | 626 到 644 | °F |
|
模具温度 | 212 到 302 | °F |
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注射速度 | 中等偏快 |
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背压 | 72.5 到 435 | psi |
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螺杆压缩比 | 2.5:1.0 |
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