ForTii® LDS51
Polyamide 4T
产品说明:
30% Glass Reinforced, Flame Retardant, Halogen free and free of red phosphorous, Laser Direct Structuring (LDS)
Special Features:
ForTii® is a breakthrough high temperature polyamide with halogen-free flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want €" and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
填料/增强材料 | |
添加剂 | |
特性 | |
加工方法 | |
树脂ID (ISO 1043) | |
密度 | 1.58 | -- | g/cm³ | ISO 1183 |
收缩率 |
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| ISO 294-4 |
横向流量 | 1.0 | -- | % |
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流量 | 0.30 | -- | % |
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拉伸模量 | 1.60E+6 | 1.60E+6 | psi | ISO 527-2 |
拉伸应力 (断裂) | 17400 | 17400 | psi | ISO 527-2 |
拉伸应变 (断裂) | 1.6 | 1.6 | % | ISO 527-2 |
简支梁缺口冲击强度 (73°F) | 1.4 | -- | ft·lb/in² | ISO 179/1eA |
简支梁无缺口冲击强度 (73°F) | 12 | -- | ft·lb/in² | ISO 179/1eU |
热变形温度 |
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66 psi, 未退火 | 590 | -- | °F | ISO 75-2/B |
264 psi, 未退火 | 554 | -- | °F | ISO 75-2/A |
玻璃转化温度 2 | 257 | -- | °F | ISO 11357-2 |
熔融温度 2 | 617 | -- | °F | ISO 11357-3 |
线形热膨胀系数 |
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| ASTM D696 |
流动 | 1.7E-5 | -- | in/in/°F |
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横向 | 2.2E-5 | -- | in/in/°F |
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体积电阻率 | > 1.0E+15 | > 1.0E+15 | ohms·cm | IEC 60093 |
相对电容率 (1.00 GHz) | 4.05 | -- |
| IEC 60250 |
漏电起痕指数 | 400 | -- | V | IEC 60112 |
可燃性等级 (0.03 in) | V-0 | -- |
| IEC 60695-11-10, -20 |
干燥温度 | 212 | °F |
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干燥时间 | 4.0 到 8.0 | hr |
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料筒后部温度 | 608 到 626 | °F |
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料筒中部温度 | 617 到 635 | °F |
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料筒前部温度 | 626 到 635 | °F |
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射嘴温度 | 626 到 635 | °F |
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加工(熔体)温度 | 626 到 644 | °F |
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模具温度 | 212 到 302 | °F |
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注射速度 | 中等偏快 |
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背压 | 72.5 到 435 | psi |
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螺杆压缩比 | 2.5:1.0 |
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