Ultraform® S 2320 003 PRO
Acetal (POM) Copolymer
Product Description:
Ultraform S 2320 003 PRO is an unfilled injection molding POM grade, which supports customers in product development for the medical technology market. This grade complied with US Pharmacopoeia: Biological Reactivity Tests, USP Plastic Class VI (USP VI), ISO 10993-5: Biological Evaluation of Medical Devices Part 5: Test for Cytotoxicity, DMF: A Drug Master File (DMF) has been registered at FDA for Ultraform® PRO and Food Contact: Ultraform® PRO is in compliance with multiple regional food contact regulations, especially for Europe and United States.
Applications
This material can be used for functional parts in devices such as insulin pens or powder inhalers as well as for plug in connectors or medical device handles.
Features | Copolymer Food Contact Acceptable
|
Uses | |
Agency Ratings | DMF Unspecified Rating EC 1907/2006 (REACH) EU Food Contact, Unspecified Rating FDA Food Contact, Unspecified Rating ISO 10993 Part 5 USP Class VI
|
RoHS Compliance | |
Forms | |
Processing Method | |
Density | 1.40 | g/cm³ | ISO 1183 |
Melt Volume-Flow Rate (MVR) (190°C/2.16 kg) | 0.671 | in³/10min | ISO 1133 |
Water Absorption |
|
| ISO 62 |
Saturation, 73°F | 0.80 | % |
|
Equilibrium, 73°F, 50% RH | 0.20 | % |
|
Ball Indentation Hardness | 21000 | psi | ISO 2039-1 |
Tensile Modulus (73°F) | 392000 | psi | ISO 527-2 |
Tensile Stress (Yield, 73°F) | 9430 | psi | ISO 527-2 |
Tensile Strain (Yield, 73°F) | 9.0 | % | ISO 527-2 |
Nominal Tensile Strain at Break (73°F) | 28 | % | ISO 527-2 |
Tensile Creep Modulus (1000 hr) | 189000 | psi | ISO 899-1 |
Charpy Notched Impact Strength |
|
| ISO 179 |
-22°F | 2.4 | ft·lb/in² |
|
73°F | 2.6 | ft·lb/in² |
|
Charpy Unnotched Impact Strength |
|
| ISO 179 |
-22°F | 81 | ft·lb/in² |
|
73°F | 86 | ft·lb/in² |
|
Heat Deflection Temperature (264 psi, Unannealed) | 212 | °F | ISO 75-2/A |
Melting Temperature (DSC) | 333 | °F | ISO 3146 |
CLTE - Flow | 6.1E-5 | in/in/°F |
|
Surface Resistivity | 1.0E+13 | ohms | IEC 60093 |
Volume Resistivity | 1.0E+15 | ohms·cm | IEC 60093 |
Dielectric Constant (1 MHz) | 3.80 |
| IEC 60250 |
Dissipation Factor (1 MHz) | 5.0E-3 |
| IEC 60250 |
Comparative Tracking Index | 600 | V | IEC 60112 |
Drying Temperature | 176 to 230 | °F |
|
Drying Time | 2.0 to 4.0 | hr |
|
Suggested Max Moisture | 0.15 | % |
|
Processing (Melt) Temp | 374 to 446 | °F |
|
Mold Temperature | 140 to 248 | °F |
|
Injection Pressure | 508 to 1020 | psi |
|
